Enhanced 3d printed support block

ABSTRACT

Support blocks for printed circuit boards (PCB&#39;s) and printed circuit board assemblies (PCBA&#39;s), wherein the support blocks are produced from a 3D printing process. The support block including a bottom surface having a vacuum connection; a top surface having at least one vacuum hole; at least one recessed surface that is offset from the top surface; and at least one vacuum channel extending from the vacuum connection to the at least one vacuum hole.

CROSS REFERENCE TO RELATED APPLICATIONS

This patent application is a continuation patent application of U.S.patent application Ser. No. 17/808,035 filed Jun. 21, 2022, which is acontinuation patent application of U.S. patent application Ser. No.17/015,841 (now U.S. Pat. No. 11,477,926) filed Sep. 9, 2020 the entirecontents of each of which are incorporated herein by reference.

FIELD

The present disclosure relates to the field of 3D printed support blocksfor screen printed circuit board assemblies, test fixtures, go-no-gofixtures, wave soldering pallets, and the like.

BACKGROUND

This section provides background information related to the presentdisclosure which is not necessarily prior art. A printed circuit boardassembly (PCBA), comprises a printed circuit board (PCB) that containselectrically conductive traces to carry electrons from one location toanother. These traces are typically made of copper and allow electronsto flow from one component to another. Components include integratedcircuits, resistors, capacitors, diodes, and others. Surface mounttechnology (SMT) describes a method whereby electrical components aremounted directly onto a surface of a printed circuit board.

In the SMT process, screen printers can be used to deposit solder pasteat defined locations on a PCB. Solder paste contains small amounts ofconductive metal that is suspended in a flux material. The flux materialtemporarily allows components to adhere to a circuit board before aheated reflow step where heat is applied to melt the metal, therebyfusing the components to the circuit board. After solder paste isdeposited onto a circuit board, components are placed on the wet solderpaste and the combined PCB, wet solder paste, and component (now inposition) are fused together in a reflow process. The reflow processheats the wet solder to melt the metal contained therein. This causesthe components to be fused to the circuit board and ensures good contactbetween the PCB and the component(s). After the reflow step, the PCBA iscooled at a specified rate and the solder solidifies, thereby attachingthe components to the PCBA.

Screen printers place stencils on PCBs and PCBAs. The stencils haveapertures where solder paste will be deposited. Solder paste is thicklyspread out on the stencil at a first side and then a squeegee is used toevenly spread the solder paste across the stencil. Solder paste fillsthe apertures (holes) in the stencil and is deposited onto the PCB (orPCBA) that is located underneath the stencil. After the squeegee hasspread the solder paste across the PCB (or PCBA), the stencil isseparated from the PCB (or PCBA), leaving a PCB (or PCBA) with wetsolder paste at specific locations. Components are then attached atthese specific locations.

The squeegee exerts a downward force on the circuit board as it spreadssolder paste across it. Therefore, to avoid bending the circuit boardand to avoid uneven solder paste thickness, the circuit board issupported from underneath. For a circuit board with a flat bottomsurface, a flat support can be used. However, for circuit boards withcomponents on both sides, a flat support does not work because of thepresence of the components. The components on the bottom side of thecircuit board could be damaged from being compressed between a flatsupport and the circuit board. Additionally, a top of the board wouldlikely be uneven when components are present on the bottom of the boardand the support is flat. For circuit boards with components on bothsides, pins of varying height or specialized support blocks (alsoreferred to as plates or pallets) are commonly used. Specialized supportblocks typically include two pieces: a top block and a bottom block. Thematerial of construction for the support blocks is typically aluminum.Instead of being flat, the top block has cut-outs to allow componentsfrom the bottom side of a PCBA to be received therein. A bottom block isattached underneath the top block so that the outer edges of the top andbottom blocks are tightly sealed. The bottom block typically has anopening for attaching a vacuum source. When a PCBA is on top of the topblock, vacuum is pulled through the opening in the bottom block tosecure the PCBA to the top block. The vacuum pressure is removed priorto removing the PCBA.

While the aforementioned support blocks have been useful in screenprinting processes, they do not provide optimal surface flatness. Thisproblem is compounded by the two-block design because there is adimensional tolerance (variation) for each block and the totaldimensional tolerance (variation) for the combined support block is thesum of each of the individual tolerances. Today's support blocks areexpensive and are often required to be produced off-site and shipped toa PCBA assembly site. The support blocks are often manufactured bysubtractive manufacturing, such as CNC machining. In subtractivemanufacturing processes, material is removed from a starting piece ofsolid material to achieve the desired shape. Therefore, when producingPCBA support blocks by subtractive manufacturing, as the number ofcomponents on a PCBA increases, the machine time and cost to produce aPCBA support block increases. Further, today's aluminum support blocksare heavy. This results in higher shipping costs and potential ergonomicissues and even injury for workers that are lifting them. Today's PCBAsupport blocks are also inefficient in the way that the vacuum isapplied.

For at least these reasons, there is a need in the art for an improvedPCBA support block.

Three-dimensional (3D) printing is any of various processes in whichmaterial is joined or solidified under computer control to create athree-dimensional object. The 3D print material is “added” onto a base,such as in the form of added liquid molecules or layers of powder grainor melted feed material, and upon successive fusion of the printmaterial to the base, the 3D object is formed. 3D printing is thus asubset of additive manufacturing (AM).

A 3D printed object may be of almost any shape or geometry, andtypically the computer control that oversees the creation of the 3Dobject executes from a digital data model or similar additivemanufacturing file (AMF) file, i.e., a “print plan”. Usually this AMF isexecuted on a layer-by-layer basis, and may include control of otherhardware used to form the layers, such as lasers or heat sources. A partfor production is, virtually-speaking, “sliced” into layers in the printplan, as discussed throughout, and these virtual layers then becomeactual layers.

There are many different technologies that are used to execute the AMF.Exemplary technologies may include: fused deposition modeling (FDM);stereolithography (SLA); digital light processing (DLP); selective lasersintering (SLS); selective laser melting (SLM); high speed sintering(HSS); inkjet print and/or particle jetting manufacturing (IPM);laminated object manufacturing (LOM); electronic beam melting (EBM); anddirect energy deposition (DED).

Some of the foregoing methods melt or soften the print material toproduce the print layers. For example, in FDM, the 3D object is producedby extruding small beads or streams of material which harden to formlayers. A filament of thermoplastic, wire, or other material is fed intoan extrusion nozzle head, which typically heats the material and turnsthe flow on and off.

Other methods, such as laser or similar beam-based or sinteringtechniques, may heat or otherwise activate the print material, such as aprint powder, for the purpose of fusing the powder granules into layers.For example, such methods may melt the powder using a high-energy laserto create fully dense materials that may have mechanical propertiessimilar to those of conventional manufacturing methods. SLS, forexample, uses a laser to solidify and bond grains of polymer, metals, orcomposite materials into layers to produce the 3D object. The lasertraces the pattern of each layer slice into the bed of powder, the bedthen lowers, and another layer is traced and bonded on top of theprevious.

In contrast, other similar methods, such as IPM, may create the 3Dobject one layer at a time by spreading a layer of powder, and printinga binder in the cross-section of the 3D object. This binder may beprinted using an inkjet-like process.

By way of further example, and as will be appreciated by the skilledartisan, high speed sintering (HSS) employs part formation through theuse of heating lamps, such as infrared (IR) lamps. More specifically, apart for production is, virtually-speaking, “sliced” into layers in theprint plan, as discussed throughout, and these virtual layers thenbecome actual layers upon application of the IR by the print process tothe treated areas of a print bed.

That is, HSS typically occurs using a “bed” of powdered print material.The print plan may select one or more locations within the powder bedthat will serve as part generation locations. Each part layer is“printed” onto the part generation pattern in the powder bed using aheat-absorbing ink. In a typical process, a broadband IR lamp thendelivers heat across the entire print bed. This heat is absorbed by theheat absorbing ink, thereby forming a part layer having only thoseshaped characteristics indicated by the pattern of the ink placed uponthe powder bed, as referenced above.

The foregoing process then repeats, layer by layer, until the completedpart is formed. The HSS process accordingly allows for highly refineddesigns that may allow for internal movement and similar interactions,even between internal aspects of a given part. Moreover, to allow forsuch refined patterning, an anti-heat agent, such as water, may also beplaced at selected locations about the print boundaries for a givenlayer pattern, so as to prevent undesired absorption of heat by thoselayers and a consequent malformation of the part.

In accordance with the foregoing, part characteristics in HSS may bevaried layer by layer, or even within layers, such as based on the inksused and/or the level of heat applied. Yet further, an entire bed may beused to create individual layer patterns for many parts with each singlepass of the IR lamp across the print powder bed.

SUMMARY OF THE INVENTION

The disclosed exemplary apparatuses, systems, and methods provide a 3Dprinted support that can be utilized in a screen-printing process toachieve a more uniform application of solder paste on a printed circuitboard or printed circuit board assembly (PCB or PCBA). Certainembodiments relate to a 3D printed PCBA support block that is lighter(in weight), has better (smaller) dimensional tolerances, enhancedflatness, has a more targeted vacuum system, and that has a single piecedesign.

In one embodiment, the 3D printed support block comprises a bottomsurface having a vacuum connection; a top surface having at least onevacuum hole; at least one recessed surface that is offset from the topsurface; and at least one vacuum channel extending from the vacuumconnection to the at least one vacuum hole. The support block can beprovided for screen printed circuit board assemblies, test fixtures,go-no-go fixtures, wave soldering pallets, and the like, for example.

In a method of producing a 3D printed support block, the methodcomprises 3D printing a support block, wherein the support blockcomprises: a bottom surface having a vacuum connection; a top surfacehaving at least one vacuum hole; at least one recessed surface that isoffset from the top surface; and at least one vacuum channel extendingfrom the vacuum connection to the at least one vacuum hole.

A screen printer for screen printing on an article such as a printedcircuit board or a printed circuit board assembly is also disclosedaccording to an embodiment of the present invention. The screen printerincludes a lift plate, a vacuum block disposed on the lift plate, atleast one support bar removably disposed on the lift plate, and a 3Dprinted support block having a bottom surface resting on both the vacuumplate and the at least one support bar and a top surface configured tosupport the article during the screen printing.

BRIEF DESCRIPTION OF THE DRAWINGS

The disclosed non-limiting embodiments are discussed in relation to thedrawings appended hereto and forming part hereof, wherein like numeralsindicate like elements, and in which:

FIG. 1 is a schematic diagram of a printed circuit board assemblyaccording to prior art.

FIG. 2 is a schematic diagram of a screen printing apparatus accordingto prior art.

FIG. 3 is a schematic perspective view of a support block according anembodiment of the invention.

FIG. 4 is a schematic perspective view of a support black having avacuum connection according to an embodiment of the invention.

FIG. 5 is a schematic perspective view of a support block with a portionthereof cut away to show a vacuum distribution system according to anembodiment of the invention.

FIG. 6 is a schematic perspective view of a support block according toan embodiment of the invention.

FIG. 7 is an exploded perspective view of a 3D printed insert holder anda magnet according to an embodiment of the invention.

FIG. 8 is an exploded perspective view of a 3D printed insert holder anda magnet according to another embodiment of the invention.

FIG. 9A a bottom perspective view of the support block of FIG. 4 .

FIG. 9B a top perspective view of the support block of FIG. 9A.

FIG. 10 is a perspective view of a screen printing apparatus includingan array of removable support bars according to an embodiment of theinvention.

FIG. 11A is a perspective view of the screen printing apparatus prior tothe placement of the removable support bars within an active area of alift plate.

FIG. 11B is a perspective view of the screen printing apparatusfollowing the placement of a first one of the removable support barswithin the active area of a lift plate.

FIG. 11C is a perspective view of the screen printing apparatusfollowing the placement of a plurality of the removable support barswithin the active area of the lift plate.

FIG. 12A is a front elevational view of the screen printing apparatuswhen the lift plate is in a lowered position.

FIG. 12B is a front elevational view of the screen printing apparatuswhen the lift plate is in a raised position.

DETAILED DESCRIPTION

The following detailed description and appended drawings describe andillustrate various embodiments of the invention. The description anddrawings serve to enable one skilled in the art to make and use theinvention, and are not intended to limit the scope of the invention inany manner. In respect of the methods disclosed, the steps presented areexemplary in nature, and thus, the order of the steps is not necessaryor critical

FIG. 1 shows a printed circuit board assembly (PCBA) 100. The PCBA 100contains components, represented in FIG. 1 as 101 a, b, c, d, e, f, andg, that are attached to a printed circuit board (PCB) 102. Traces 103are used to carry electrons from one location to another. The components101 a, b, c, d, e, f, and g are three dimensional and extend from thePCB.

FIG. 2 shows an apparatus that is commonly used to screen print solderpaste onto the PCB 102. A stencil 200 contains apertures 201 (and otherapertures as shown by squares and rectangles in FIG. 2 ) that are cutout from the stencil 200. The PCB 102 (not shown in FIG. 2 ) is locateddirectly underneath the stencil so that solder paste 202 that isdeposited into the apertures 201 is deposited onto a surface of the PCB102 at defined locations. The solder paste 202 is deposited on thestencil 200 and a squeegee 203 moves in a direction of arrows 204 toevenly spread the solder paste 202 across the stencil 200 and into theapertures 201. After the solder paste 202 is evenly spread across thestencil 200, the stencil 200 is separated from the PCB. At this point,the PCB has wet solder paste at the proper locations and is ready forcomponents to be placed onto it, commonly by a pick and place machine.

FIG. 3 shows a support block 300 according to an embodiment of theinvention. The support block 300 shown is 3D printed by an additivemanufacturing process and can have a single piece design as shown inFIG. 3 . A single piece design is beneficial because it minimizes adimensional tolerance of the support block 300 and optimizes a flatnessthereof. In a two-block design, a bottom block has a dimensionaltolerance and a top block has a dimensional tolerance. The totaldimensional tolerance for a two block support system is thus equal to asum of the dimensional tolerance of the bottom block and the dimensionaltolerance of the top block. For a single piece design, on the otherhand, there is only one dimensional tolerance. Because there is a singletolerance, the single piece design of the instant invention allows aflatness of the support block 300 to be more easily achieved,specifically on a top surface 302 of the support block 300 that holdsthe PCBA (or PCB). Although the PCB is described herein as an example,it is understood that the support block can be provided for othersystems such as test fixtures, go-no-go fixtures, wave solderingpallets, and the like, for example. Triangular supports 301 formed inthe support block 300 efficiently transfer downward pressure (forexample, from a squeegee) that is exerted on the top surface 302 of thesupport block 300 directly to a bottom surface 303 of the support block300. The triangular supports 301 may also function as vacuum channelsdiscussed in more detail hereinbelow. The support block 300 as shown isan advantage over prior art support block systems, such as aluminumsystems, where a z-strength (strength in an up and down direction) is afunction of a strength and a thickness of the top surface of the supportblock (for example, when the top, horizontally oriented surface is notsupported from underneath). FIG. 3 also shows magnet openings 304,magnet channels 305, and recessed areas 306. In an embodiment, themagnet openings 304 and the magnet channels 305 configured to receivemagnets (not shown) therein. The magnets can have a desirable shape suchas spherical, puck-shaped, cylindrical, or other shapes. A shape of themagnet channels 305 may be selected to match the shape of the magnetsthat are used. For example, a circular shaped magnet channel may beprovided for a spherically shaped magnet, a square shaped magnet channelmay be provided for a cube or a square shaped magnet, and the like. Inan embodiment, the recessed areas 306 are configured so that thecomponents of the PCBA fit within the recessed areas 306. In anembodiment, vacuum holes 307 (and associated vacuum channels formedwithin the support block 300) are provided to aid with securing the PCBor the PCBA to the support block 300.

The 3D printed support block 300 according to the invention enables amore efficient use of vacuum suction used during the manufacturingprocess. Because of the single piece design and the ability to createthe vacuum channels with specific geometries for optimal vacuum atspecific locations, the 3D printed support block 300 allows a vacuum tobe applied only at specific locations where it is needed. Because ofunique geometries that are made possible by 3D printing, the vacuumchannels can be included in the 3D printed support block 300 thatprovide the vacuum at the specific locations. This is a more efficientvacuum process because a volume that has to be evacuated (by suction) toreach a desired vacuum pressure is minimized.

FIG. 4 shows an embodiment of the invention having a vacuum connection401 formed in a support block 404. A vacuum source (not shown), forexample, a vacuum hose or duct, can connect to the vacuum connection 401to pull a vacuum on the vacuum holes 402 and on vacuum channels 403formed within the support block 404. There may be a number of vacuumholes 402 and vacuum channels 403 formed within the support block 404,as desired. In FIG. 4 , the vacuum holes 402 are formed in the vacuumconnection 401. The vacuum holes 402 may be located on a top surface ofsupport block 404, or elsewhere, as desired. The vacuum channels 403shown are disposed around a perimeter of the vacuum connection 401, butcan be formed elsewhere, as desired. The vacuum channels 403 shown areenclosed channels that lead to specific locations on a top surface ofsupport block 404. It is understood the vacuum channels 403 may haveother configurations without departing from the scope of the invention.

FIG. 5 shows a cut-away view of a support block 500 according to anembodiment of the invention. FIG. 5 shows a cut-away view to bettervisualize a vacuum distribution system. A vacuum connection 501 providesa connection point for connecting a vacuum source to a support block500. The vacuum connection 501 may be 3D printed with a specific shapethat allows a given vacuum duct or vacuum hose to easily connect to it(from the bottom side in FIG. 5 ). Vacuum holes 502 are located in a topsurface of the support block 500. Vacuum is applied to the vacuumconnection 501 and pulls a vacuum through the vacuum holes 502.Additionally, vacuum channels 503 connect the vacuum connection 501 todistributed vacuum locations 505 to provide vacuum at the distributedvacuum locations 505. Because the vacuum connection 501 is fluidlyconnected to each of the distributed vacuum locations 505 (shown asholes on top of vacuum channels 503), applying a vacuum to vacuumconnection 501 results in a vacuum applied at each of the distributedvacuum locations 505. In this way, a PCB or PCBA may be held in place bya distributed vacuum system while minimizing a volume that must beevacuated (placed under vacuum). The support block 500 may include anynumber of the vacuum holes 502, the vacuum channels 503, and thedistributed vacuum, locations 505 as desired. The support block 500 mayinclude one or more of the vacuum channels 503. The vacuum channels 503may support the top side of the support block 500 by providing a rigidstructure that directly connects to the top surface of the support block500 and directly connects to a bottom surface of the support block 500.In this way, the vacuum channels 503 may serve both as vacuumdistribution channels, as well as structural supports.

When using a subtractive manufacturing process, such as CNC machining,an amount of wasted material increases as an amount of open area isincreased. More open area is required as the number of components on aPCBA increases. Therefore, the machining time to manufacture a supportblock for a PCBA with a large number of components is longer than themachining time to make a support for a PCBA with a small number ofcomponents, when using a subtractive manufacturing process. When usingan additive manufacturing process, such as 3D printing (e.g. fusedfilament fabrication (FFF) printing and others), the amount of materialthat is used to make a support block and the machine time that isrequired to produce a support block are inversely related to the numberof components on a PCBA board. In other words, a 3D printed PCBA supportblock for a PCBA with a high number of components requires less materialand is faster to manufacture, compared to a support block designed for aPCBA with a fewer number of components. As PCBA's contain more and morecomponents, 3D printed support blocks become more and more attractive.

3D printed PCBA support blocks can also be lighter in weight thanstandard aluminum support blocks. 3D printed support blocks (produced byfused filament fabrication (FFF)) do not have solid cores. Instead 3Dprinted (using FFF) support blocks fill void areas with infill, which isa repetitive structure that partially fills void spaces and providesstructure to a 3D printed object. For example, a 3D printed supportblock, such as the support block 600 shown in FIG. 6 , may be producedwith 20% infill (i.e. 20% infill density) to result in a support blockthat is much lighter than an aluminum support block. Infill density maybe 20% percent by volume. Infill amount may be varied to achieve adesired strength and/or weight. By using polymer/composite materials andby using an infill that is less than 100%, the weight of a PCB/PCBAsupport block is significantly reduced. For example, aluminum machinedblocks can weigh 10 pounds or more, while 3D printed blocks with 20%infill can weigh less than 2 lbs. This results in better ergonomics,reduced risk of personal injury when handling, and lower shipping costs.3D printed support blocks with reduced weight are also easier toposition in a screen printer and are easier for operators to handle whenchanging support blocks. It is understood that any screen printer may beused such as an MPM brand or DEK brand screen printer without departingfrom the scope of the invention.

In addition to selecting 3D-printable materials for weightconsideration, a material may also be selective for othercharacteristics. For example, electrostatic-discharge protected,polyethylene terephthalate glycol (PETG-ESD) is a desirable materialbecause it will not corrode and it is dissipative, unlike aluminum whichis conductive. A carbon filled nylon may be used to 3D print a PCBAsupport block that has a high Young's Modulus (a stiff support block).ESD-safe acrylonitrile butadiene styrene (ABS ESD), ESD-safepolycarbonate/acrylonitrile butadiene styrene (PC-ABS ESD), and/orESD-safe polycarbonate may also be used to manufacture 3D-printed PCBAsupport blocks.

Further, multiple materials may be used to manufacture a 3D printedsupport block. For example, a first material may be used to 3D print themajority of a PCBA support block and a second material may be used tocreate circumferential seals around the vacuum holes to improve vacuumseal to a PCBA or PCB. In this example, the first material may bePETG-ESD and the second material may be a thermoplastic elastomer suchas styrene-ethylene-butylene-styrene (SEBS) (to improve the vacuum sealto the PCBA or PCB and/or to provide cushion between a PCBA or PCB andthe support block). Additionally, a second material may be used tocreate the vacuum channels. For example, a material that has a low gaspermeability may be selected and used to create the vacuum channels toachieve a better (lower pressure) vacuum. These multiple materials areeasily used in the 3D printing process.

In another embodiment, a first material may be used to 3D print themajority of a PCBA support block and a second material may be used forthe top surface of the support block. In this example, the firstmaterial may be PETG-ESD and the second material may be a thermoplasticelastomer such as styrene-ethylene-butylene-styrene (SEBS) (to improvethe vacuum seal to the PCBA or PCB and/or to provide cushion between aPCBA or PCB and the support block).

Multiple materials may also be used to print a support block having abase that is printed using a rigid/stiff material and an upper layer orlayers that is/are printed using an elastomeric material In thisexample, the elastomeric material could provide a cushion for the PCBA,or provide “suction features” to better hold the PCBA when the vacuum isapplied. An elastomeric material can be added around the perimeter ofvacuum holes in embodiments. An elastomeric material can be used toconstruct the top surface of a 3D printed support block in embodiments.

Further, a multiple-material print may provide a 3D printed supportblock that comprises a top and bottom layer that are made of a materialthat is selected for its ability to achieve good flatness while themiddle layer of the 3D printed support is made of a material that isselected for another property (for example: cost, strength, weight,density, etc.).

The flatness of 3D-printed support blocks can be even further improvedusing magnets. As shown in FIG. 6 , a 3D-printed support block 600 canbe manufactured with magnet holder locations 601. Magnets 602 can beinserted into the magnet holder locations 601 for improved support blockflatness. The magnets 602 may be press fit into the magnet holderlocations 601. That is, the magnets 602 may fit tightly within themagnet holder locations 601 to hold the magnets 602 in the magnet holderlocations 601. The magnets 602 may be magnetically attracted to a metalsurface that is located underneath the 3D-printed support block 600.Because the 3D-printed PCBA support block 600 has some flexibility, themagnets can bend/flex the 3D printed PCBA support block 600 to improveflatness. Very stiff PCBA support blocks, such as those made fromaluminum, do not have the flexibility required for magnets to bend them.

FIG. 7 shows a 3D printed insert holder that may be included in variousembodiments. For example, an insert holder 700 may be 3D printed as anintegral part of a 3D printed support block. The insert holder 700includes a roof 701 and at least one support stand 702. The supportstand 702 may be a column or strand of material to maintain the roof 701in a desired orientation or location. A magnet channel 703 is defined byouter perimeter 704. A magnet 705 can be positioned or slid under theroof 701 and into the magnet channel 703 where it falls downward withinthe magnet channel 703. Positioning of the magnet 705 is indicated by anarrow in FIG. 7 . As shown in FIG. 7 , the 3D printed insert holder 700(specifically, the roof 701) prevents the magnet 705 from falling out ofa support block when the support block is oriented upside down (with thetop opening of magnet channel 703 facing towards the Earth's surface).

FIG. 8 shows a 3D printed insert holder 800 that is designed forpuck-shaped magnets. The insert holder 800 includes a roof 801, at leastone support stand 802, and a magnet channel 803. A distance between roof801 and a top of the magnet channel 803 may be selected so a magnet 804can narrowly slide between the roof 801 and the top of the magnetchannel 803, thereby minimizing a profile of the insert holder 800.Positioning of the magnet 804 is indicated by an arrow in FIG. 8 . Asshown in FIGS. 7 and 8 , 3D printed insert holders may be designed toaccommodate magnets of varying shapes and sizes.

When recycling support blocks, it may be desirable to remove the magnetsprior to recycling. Advantageously, the insert holders of FIGS. 7 and 8may be designed so that the roof and/or stands can be snapped off(removed from) the support block to create an unrestricted opening forthe magnets to fall out of when the support block is inverted (turnedupside down). After removing the insert holder(s) (i.e. removing theroof(s) and/or stand(s)), support blocks can simply be turned upsidedown to cause magnets to fall out of (away from) the support block. Themagnets can be reused and the magnet-free support blocks can berecycled.

In another embodiment, an improved PCBA support block may comprise a 3Dprinted support block (having openings for PCBA components to fit into)that is attached on top of a flat metal block. The 3D printed supportblock may be attached to the flat metal block using bolts or othersuitable fasteners (such as screws, clamps, magnets, ties, adhesive,etc.). This design allows custom detail to be achieved via 3D printingand allows improved flatness by bolting the 3D printed portion to aflat, metal (or other stiff material), bottom block. Further, thisdesign allows a shorter 3D printed support block to be combined with asecond piece to form a support block that can be used with tall supportblock geometries. In other embodiments, parallel support blocks may beused in conjunction with a 3D printed support block. The parallelsupport blocks can be placed underneath the 3D printed support block ina screen printer. The size of the 3D printed support block woulddetermine the number of parallel support blocks to be used. The parallelsupport blocks would have a metal top surface so that magnets could beused to attach the 3D printed support block to the top surface of theparallel support blocks.

Polymeric, 3D printed support blocks also reduce the risk of scratchingthe PCBA's that they are supporting, compared to aluminum supportblocks.

3D printed PCBA support blocks facilitate the use of embedded bar codesfor error-proofing and/or inventory control. A 3D printed bar code caneasily be added directly on a PCBA support block as the block is beingproduced. Alternatively, an RFID tag could be inserted inside the 3Dprinted PCBA support block, during the 3D printing process, to eliminatethe risk of losing the tag and to add remote traceability features.

3D printed PCBA support blocks simplify logistics and are recyclable. 3Dprinted PCBA support blocks may be manufactured at the PCBA assemblysite that uses them instead of manufacturing PCBA frames off-site andshipping them to the point of use. Unlike CNC machining, which usescutting oils and produces metal chips, most 3D printing techniques areinherently clean, which allows 3D printing to take place next to a PCBAproduction line. For example, 3D printing may proceed in an ISO1, ISO2,ISO3, ISO4, ISO5, ISO6, ISO7, ISO8, or ISO9 class clean room, as definedby ISO 14644-1 Cleanroom Standards. This would greatly reduce the timebetween support frame design and support frame use. Recyclable polymersmay be used to manufacture PCBA support blocks. This would allowpreviously used support blocks to be melted, reprinted (3D printed), andused again. Because PCBA support blocks are custom designed for a givenPCBA, there would be a significant time and material savings by 3Dprinting PCBA support blocks at the site where PCBA's are assembled. Aneven greater savings could be realized by recycling previously used 3Dprinted PCBA support blocks (either at a separate location or at thePCBA assembly site). When recycling previously used 3D printed supportblocks, previously used 3D printed support blocks may be used asfeedstock for 3D printing new support blocks.

Another advantage of 3D printing support blocks is the ability to adjustthe print speed (production rate) based on the end user's requirements.For example, when a PCBA has fine-pitch components, tighter tolerances(flatness) are required for the support block. In this case, slower 3Dprint speeds could be used for optimal print quality. On the other hand,PCBAs using standard-pitch components would not require such tighttolerances and a faster print speed may be possible. Optimal speedscould be adjusted in software. For example, a user could select a“precision print mode” when printing a support block for an applicationwhere a PCBA has fine-pitch components or a user could select a “fastprint mode” when printing a support block for an application where aPCBA has standard-pitch components.

The 3D printed support block disclosed in this application mayadditionally have applications in areas beyond screen printing. Forexample, the 3D printed support block may be used in x-ray machines thatare used to inspect PCBA's.

Turning now to the embodiment shown in FIG. 9A, a bottom view of asupport block 900 is shown. The support block 900 has a top side 901 anda bottom side 902. Also shown are vacuum holes 903 and vacuum channels904. Vacuum connection 905 is also present for connecting a vacuumsource to support block 900.

FIG. 9B shows a top view of support block 900. The support block 900 hasa top side 901 and a bottom side 902. The support block 900 comprisesvacuum holes 903, magnet openings 904, and recessed areas 905. Recessedareas 905 may receive PCBA components, thereby allowing a PCBA to layflat on the top side 901.

FIG. 10 shows an apparatus 1000 according to an embodiment of theinvention. The apparatus 1000 includes a support block 1001, a liftplate 1020, a vacuum block 1030, a conveyor 1040, and at least onesupport bar 1050. The apparatus 1000 is configured for use during amanufacturing process performed with respect to an article 1100 that issupported on the support block 1001 during the manufacturing process.The article 1100 may be a PCB or a PCBA as previously described herein.

The manufacturing process carried out with respect to the article 1100may be a screen printing process and hence the apparatus 1000 may be ascreen printer or a mechanism of a screen printer. The screen printingprocess may include solder paste being deposited on a stencil (notshown) overlaying the article 1100 with the stencil having aperturesformed therein, wherein a spreading of the solder paste by a squeegee(not shown) or the like results in the solder paste being evenly spreadacross the stencil and into the corresponding apertures communicatingwith a surface of the article 1100. The screen printing process includespressure being applied to the article 1100 in a direction towards theunderlying support block 1001, hence it is desirable to include aminimized dimensional tolerance of a top surface 1002 of the supportblock 1001 on which the article 1100 rests during the screen printingprocess. In addition to the described screen printing process, theapparatus 1000 may be utilized with respect to any manufacturing processcarried out with respect to the article 1100 and the support block 1001wherein a flatness of the top surface 1002 of the support block 1001 isrelevant to optimizing the manufacturing process carried out withrespect to the article 1100. Although the PCB or the PCBA are describedherein as examples forming the article 1100 for use with the apparatus1000, the support block 1001 can be provided for other systems such astest fixtures, go-no-go fixtures, wave soldering pallets, and the like.

The support block 1001 may be 3D printed by an additive manufacturingprocess to cause the support block 1001 to have a single piece design.The single piece design of the support block 1001 is beneficial forminimizing a dimensional tolerance of the support block 1001 andoptimizing the flatness thereof, and especially the top surface 1002 ofthe support block 1001 on which the article 1100 rests during themanufacturing process.

The support block 1001 is illustrated in FIG. 10 as including a bottomsurface 1003 arranged parallel to and opposing the top surface 1002thereof. The support block 1001 further includes at least one magnetopening 1004 with each of the magnet openings 1004 leading to acorresponding magnet channel 1005, at least one recessed area 1006, andat least one vacuum hole 1007. Each of the magnet openings 1004 is shownas being formed within one of the recessed areas 1006, but some or allof the magnet openings 1004 may alternatively be formed in the topsurface 1002. Each of the magnet channels 1005 may be configured toreceive a magnet (not shown) therein or an insert holder (not shown)encapsulating a magnet therein. Each of the recessed areas 1006 may beconfigured to receive a component of the article 1100 projecting awayfrom a surface of the article 1100 facing towards the top surface 1002of the support block 1001, as one example. In the event the article 1100is a PCB or PCBA, the components may be electrical components suchintegrated circuits, resistors, capacitors, diodes, and the like. Eachof the recessed areas 1006 may accordingly include a perimeter shape anddepth corresponding to the shape and depth of the aligned componentsprojecting from the article 1100. Each of the vacuum holes 1007 may bein communication with one or more corresponding vacuum channels (notshown) formed within the support block 1001. Each of the vacuum channelsmay in turn be in communication with one or more corresponding vacuumconnections (not shown) intersecting the bottom surface 1003 of thesupport block 1001. Each of the vacuum connections may be positioned onthe bottom surface 1003 for communication with a corresponding portionof the vacuum block 1030, as explained in greater detail hereinafterwhen describing the vacuum block 1030 and the operation thereof.

The support block 1001 as illustrated for use with the apparatus 1000 istherefore merely exemplary in nature and may be representative of any ofthe support blocks 300, 404, 500, 600, 900 disclosed herein as well asany described variations or combinations of the features thereof. Thesupport block 1001 may also be configured for use with any independentlyprovided component such as one of the disclosed insert holders 700, 800for carrying a magnet received within one of the magnet channels 1005.

The lift plate 1020 includes a support surface 1021 for supporting thevacuum block 1030 and each of the support bars 1050. The lift plate 1020is configured to translate in a first direction arranged perpendicularto the support surface 1021 as indicated by axis 1070 in FIG. 10 . Thefirst direction may be a vertical direction arranged parallel to thedirection of gravity. The lift plate 1020 may be operatively coupled toan actuator causing the linear translation of the lift plate 1020 whilemaintaining the same orientation as illustrated in FIG. 10 .

The conveyer 1040 includes a first conveyer element 1041 having a firstengaging surface 1042 and an oppositely arranged second conveyer element1043 having a second engaging surface 1044. The conveyer elements 1041,1043 and the corresponding engaging surfaces 1042, 1044 extendlongitudinally in a second direction arranged parallel to the supportsurface 1021 of the lift plate 1020 and perpendicular to the firstdirection. The second direction is indicated by axis 1080 in FIG. 10 .The second direction may be a horizontal direction arrangedperpendicular to the direction of gravity. The engaging surfaces 1042,1044 are arranged on a plane arranged parallel to the plane of thesupport surface 1021 and are configured to support opposing sides of thearticle 1100. The engaging surfaces 1042, 1044 may be formed by conveyerbelts, sliding carriages, or the like configured to selectivelytranslate the article 1100 in the second direction relative to theunderlying lift plate 1020 as indicated by arrow 1045 in FIG. 10 .

The first conveyer element 1041 and the second conveyer element 1043 arespaced apart from each other with respect to a third direction arrangedparallel to the support surface 1021 and perpendicular to each of thefirst direction and the second direction. The third direction isindicated by axis 1090 in FIG. 10 . In an embodiment of the apparatus1000, the space present between the first conveyer element 1041 and thesecond conveyer element 1043 with respect to the third direction may beadjustable to accommodate articles 1100 of varying dimensions. Forexample, the second conveyer element 1043 may remain substantiallystationary at a position adjacent the vacuum block 1030 while the firstconveyer element 1041 may be configured to translate with respect to thethird direction towards or away from the second conveyer element 1043.The spacing between the first conveyer element 1041 and the secondconveyer element 1043 may also be selected to be equal to or greaterthan a dimension of the support block 1001 in the third direction toallow for passage of the support block 1001 between the opposingconveyer elements 1041, 1043 during vertical translation of the liftplate 1020 towards the conveyer elements 1041, 1043 as explainedhereinafter.

The vacuum block 1030 is disposed on the support surface 1021 of thelift plate 1020 at a position biased towards the second conveyer element1043. The vacuum block 1030 is fixed in position on the lift plate 1020to allow for the support bars 1050 and the support block 1001 to bepositioned on the lift plate 1020 relative to the fixed position of thevacuum block 1030.

The vacuum block 1030 includes a top surface 1031 arranged parallel tothe support surface 1021 with the top surface 1031 configured to engagea portion of the bottom surface 1003 of the support block 1001 disposedtowards the second conveyer element 1043. The top surface 1031 isprovided to be flat to properly support the support block 1001 in orderto avoid a disorientation or misalignment of the support block 1001during the manufacturing process such as the described screen printingprocess. The top surface 1031 is spaced apart from the support surface1021 by a height dimension of the vacuum block 1030 extending in thefirst direction.

In the illustrated embodiment, the vacuum block 1030 is substantiallyrectangular cuboid in shape and extends longitudinally in the seconddirection. The top surface 1031 thereof similarly extends in the seconddirection with the top surface 1031 positioned between the first andsecond conveyer elements 1041, 1043 with respect to the third directionand biased towards the second conveyer element 1043.

The vacuum block 1030 is best shown in FIG. 11A which shows theapparatus 1000 prior to placement of the support block 1001 and thesupport bars 1050 as utilized during the manufacturing process. Thevacuum block 1030 includes a vacuum coupling 1032 leading to a vacuummanifold 1033. The vacuum coupling 1032 fluidly connects the vacuumblock 1030 to a vacuum source (not shown) configured to generate asuction pressure within the vacuum manifold 1033. The vacuum manifold1033 is fluidly coupled to at least one vacuum port 1034 provided in thetop surface 1031 of the vacuum block 1030. At least one of the vacuumports 1034 is configured to be placed in fluid communication with atleast one of the vacuum connections formed on the bottom surface 1003 ofthe support block 1001. In an embodiment of the invention, the supportblock 1001 may include one elongate vacuum connection formed in thebottom surface 1003 thereof acting as a manifold opening with each ofthe vacuum ports 1034 fluidly communicating with the single vacuumconnection. In other embodiments, the support block 1001 may includemultiple vacuum connections with each of the vacuum connections fluidlyconnected to one or more of the vacuum ports 1034. The vacuum block 1030is shown as including a plurality of the vacuum ports 1034 arranged in arectilinear array extending in the second direction, but alternativearrangements of the vacuum ports 1034 may be utilized so long as thevacuum ports 1034 are positioned to correspond to each of the positionsof the vacuum connections formed in the support block 1001.

Each of the support bars 1050 includes a bottom surface 1051 configuredto rest on the support surface 1021 of the lift plate 1020, a topsurface 1052 spaced apart from the support surface 1021, a first sidesurface 1053 connecting the bottom and top surfaces 1051, 1052 at afirst side of the corresponding support bar 1050, and a second sidesurface 1054 connecting the bottom and top surfaces 1051, 1052 at anopposing second side of the corresponding support bar 1050. Each of thesupport bars 1050 includes a substantially rectangular cuboid shape witheach of the support bars 1050 extending longitudinally in the seconddirection parallel to the direction of extension of the vacuum block1030. Each of the support bars 1050 may be hollow with a longitudinallyextending opening 1055 formed therethrough from opposing ends of each ofthe support bars 1050. The hollowness of each of the support bars 1050may be selected to minimize an amount of material used to form each ofthe support bars 1050, thereby minimizing a weight and cost of each ofthe support bars 1050.

In one embodiment, all of the support bars 1050 may be provided toinclude the same shape and the same dimensions in a manner wherein thesupport bars 1050 are interchangeable with each other. A lengthdimension of each of the support bars 1050 may be selected to correspondto a length dimension of the vacuum block 1030 or the support block 1001as measured in the second direction. The width dimension of each of thesupport bars 1050 measured between the opposing side surfaces 1053, 1054may be selected to allow for a desired number of the support bars 1050to be disposed beneath the support block 1001 and between the opposingconveyer elements 1041, 1043. In some embodiments, at least some of thesupport bars 1050 may include a different width dimension to allow for acombination of the support bars 1050 to accommodate articles 1100 ofvarying widths that do not correspond substantially to a given quantityof the uniform support bars 1050.

The height dimension of each of the support bars 1050 is selected to beequal to the height dimension of the vacuum block 1030. Additionally,even if some of the support bars 1050 include different width or lengthdimensions, all of the support bars 1050 are provided to include thecommon height dimension. As a result, all of the top surfaces 1052 ofthe support bars 1050 and the top surface 1031 of the vacuum block 1030are arranged on a common plane arranged parallel to the support surface1021 and spaced therefrom by the height dimension of each of the supportbars 1050 and the vacuum block 1030. The co-planar arrangement of all ofthe top surfaces 1031, 1052 provides a flat surface on which thecorresponding portions of the bottom surface 1003 of the support block1001 may rest in order to aid in establishing a flatness of the supportblock 1001.

Each of the support bars 1050 may be formed from a magneticallyattractive material configured to magnetically attract the magnetsconfigured for reception within the magnet channels 1005 of the supportblock 1001. The magnetically attractive material may be a ferrousmaterial such as steel or various alloys thereof.

The support surface 1021 of the lift plate 1020 is subdivided into aholding area 1022 and an active area 1023. The holding area 1022 isconfigured to support any of the support bars 1050 that are notinstantaneously disposed between the conveyer elements 1041, 1043 at aposition suitable for supporting the support block 1001. In contrast,the active area 1023 is configured to support any of the support bars1050 positioned to cooperate with the vacuum block 1030 for supportingthe support block 1001. The active area 1023 is accordingly disposedbetween the conveyer elements 1041, 1043 with respect to the thirddirection and beneath the position of the support block 1001 when themanufacturing process is carried out by the apparatus 1000.

As shown in FIGS. 11A-11C, the arrangement of the array of the supportbars 1050 suitable for subsequently supporting the support block 1001may be achieved by first disposing one or more of the support bars 1050on the holding area 1022. The lift plate 1020 is moved with respect tothe first direction to a position wherein a space between the supportsurface 1021 and the first conveyer element 1041 is greater than aheight dimension of each of the support bars 1050. Each of the supportbars 1050 is then able to be translated from the holding area 1022 tothe active area 1023 by sliding each of the respective support bars 1050under the first conveyer element 1041 and towards the vacuum block 1030with respect to the third direction as indicated by arrow 1057 in FIG.11B. This process is repeated until a desired quantity of the supportbars 1050 is positioned within the active area 1023 as shown in FIG.11C. The vacuum block 1030 and the desired quantity of the support bars1050 are then positioned to provide a flat series of surfaces on whichthe bottom surface 1003 of the support block 1001 may rest prior toinitiation of the manufacturing process.

Although not illustrated, the support bars 1050 and the support surface1021 of the lift plate 1020 may include complimentary structuresextending in the third direction to allow for a desired placement andthen sliding of the support bars 1050 to the position suitable forreception of the support block 1001 thereon. For example, the supportsurface 1021 and the bottom surface 1051 of each of the support bars1050 may include complimentary rails, grooves, indentations,projections, or other sliding connection features that prescribe asliding of each of the support bars 1050 from the holding area 1022 tothe active area 1023 while maintaining a desired orientation andrelative positioning of each of the support bars 1050.

FIGS. 12A and 12B show a method of operation of the apparatus 1000following the placement of a desired quantity of the support bars 1050within the active area 1023 as well as the placement of the supportblock 1001 on the cooperating support bars 1050 and vacuum block 1030.The support block 1001 is positioned on the vacuum block 1030 to allowfor any vacuum connections present on the bottom surface 1003 of thesupport block 1001 to fluidly communicate with the corresponding vacuumports 1034 present on the top surface 1031 of the vacuum block 1030. Thearticle 1100 is also positioned with respect to the second direction onthe engaging surfaces 1042, 1044 of the conveyer 1040 above the supportbars 1050, the vacuum block 1030, and the support block 1001.

FIG. 12A shows the lift plate 1020 when in a lowered position with thesupport block 1001 positioned below the conveyer 1040. The article 1100may be conveyed to the position above the support block 1001 when thelift plate 1020 is in the lowered position. FIG. 12B shows the liftplate 1020 after having been translated upwardly with respect to thefirst direction to a raised position with the top surface 1002 of thesupport block 1001 engaging an underside of the article 1100. Anycomponents projecting from the underside of the article 1100 arereceived within the recessed areas 1006 formed in the support block1001.

Any magnets received within the magnet channels 1005 of the supportblock 1001 are magnetically attracted to the underlying support bars1050 to aid in flattening the support block 1001. For example, anywarping of the support block 1001 may be minimized to promote theflatness of the top surface 1002 and the bottom surface 1003 of thesupport block 1001. The vacuum manifold 1033 is also placed incommunication with the vacuum source to draw air towards the vacuumsource through the vacuum holes 1007, vacuum channels, vacuumconnections, and vacuum ports 1034, which in turn aids in securing thearticle 1100 to the top surface 1002 of the support block 1001 duringthe manufacturing process. The manufacturing process such as thedescribed screen printing process is then able to be carried out on theexposed surface of the article 1100 while maintaining the flatnessspecifications of the article 1100.

The apparatus 1000 provides numerous advantageous features. The supportbars 1050 are easily manufactured and are low cost due to theminimization of material utilized in forming the support bars 1050. Themodular configuration of the support bars 1050 also allows for acustomization of the array of the support bars 1050 in order toaccommodate articles 1100 of differing dimensions and configurations asfewer or more of the support bars 1050 may be easily slid into positionwithin the active area 1023 of the lift plate 1020. The cooperation ofthe support bars 1050 and the vacuum block 1030 provides a relativelylarge flat area onto which the support block 1001 may be reliablymounted. The magnetic material used to form the support bars 1050 allowsfor the support bars 1050 to aid in flattening the support block 1001via the magnetic attraction present between the support bars 1050 andany magnets disposed within the support block 1001. The manifoldconfiguration of the vacuum block 1030 allows for a better distributionof the suction pressure to any vacuum connections formed within thesupport block 1001, which in turn promotes an equalization of thesuction generated at each of the vacuum holes 1007. In view of each ofthe above advantages, the article 1100 is able to be flattened relativeto the support block 1001 within dimensional tolerances to ensure thatthe manufacturing process is carried out in a desired manner, such asensuring that a screen printing process is carried out evenly across theexposed surface of a PCB or a PCBA acting as the article 1100.

In the foregoing detailed description, it may be that various featuresare grouped together in individual embodiments for the purpose ofbrevity in the disclosure. This method of disclosure is not to beinterpreted as reflecting an intention that any subsequently claimedembodiments require more features than are expressly recited.

Further, the descriptions of the disclosure are provided to enable anyperson skilled in the art to make or use the disclosed embodiments.Various modifications to the disclosure will be readily apparent tothose skilled in the art, and the generic principles defined herein maybe applied to other variations without departing from the spirit orscope of the disclosure. Thus, the disclosure is not intended to belimited to the examples and designs described herein, but rather is tobe accorded the widest scope consistent with the principles and novelfeatures disclosed herein.

What is claimed is:
 1. A method for producing a 3D printed supportblock, the method comprising: 3D printing a support block, wherein thesupport block comprises: a bottom surface having a vacuum connection; atop surface having at least one vacuum hole; at least one recessed areahaving at least one surface that is offset from the top surface; and atleast one vacuum channel extending from the vacuum connection to the atleast one vacuum hole, wherein the 3D printed support block, when in useduring a manufacturing process, directly contacts an article to besupported during the manufacturing process.
 2. The method of claim 1,wherein the 3D printed support block is printed in a clean room, asdefined by ISO 14644-1 Cleanroom Standards.
 3. The method of claim 1,wherein a feedstock material for the 3D printing is produced fromliquefied recycled 3D printed support blocks.
 4. An apparatus forsupporting an article, comprising: a vacuum block in communication witha vacuum source; and a solid 3D printed support block disposed adjacentthe vacuum block, the 3D printed support block comprising: a bottomsurface having a vacuum connection in communication with the vacuumblock; a top surface having at least one vacuum hole; at least onerecessed area formed in the top surface; and at least one vacuum channelextending from the vacuum connection to the at least one vacuum hole. 5.A 3D printed support block comprising: a bottom surface having a vacuumconnection; a top surface having at least one vacuum hole; at least onerecessed area having at least one surface that is offset from the topsurface; at least one vacuum channel extending from the vacuumconnection to the at least one vacuum hole, wherein the 3D printedsupport block, when in use during a manufacturing process, directlycontacts an article to be supported during the manufacturing process;and a magnet channel extending from the top surface or the at least onesurface of the at least one recessed area towards the bottom surface. 6.The 3D printed support block of claim 5, wherein at least one magnet isdisposed within the magnet channel
 7. The 3D printed support block ofclaim 5, wherein the 3D printed support block is produced from acontinuous piece of extruded polymer.
 8. The 3D printed support block ofclaim 5, wherein at least a portion of the 3D printed support block isproduced from an electrostatic-discharge protected, polyethyleneterephthalate glycol
 9. The 3D printed support block of claim 5, whereina portion of the 3D printed support block is produced from athermoplastic elastomer.
 10. The 3D printed support block of claim 5,wherein a portion of the 3D printed support block is produced fromstyrene-ethylene-butylene-styrene.
 11. The 3D printed support block ofclaim 5, wherein the magnet channel forms an opening and an insertholder is disposed in the opening.
 12. The 3D printed support block ofclaim 5, wherein the 3D printed support block is mechanically ormagnetically fastened to at least one parallel support block positionedadjacent the 3D printed support block.
 13. The 3D printed support blockof claim 5, wherein a first material is deposited to form a portion ofthe 3D printed support block and a second material is depositedcircumferentially around the at least one vacuum hole.
 14. The 3Dprinted support block of claim 5, wherein the 3D support block isdisposed in one of a screen printer, a test fixture, a go-no-go fixture,and a wave soldering pallet.
 15. The 3D printed support block of claim5, wherein the top surface is produced from a first material and aremainder of the 3D printed support block is produced from a secondmaterial.
 16. The 3D printed support block of claim 5, wherein the atleast one recessed area is configured to receive at least one electricalcomponent of the article therein.
 17. The 3D printed support block ofclaim 5, wherein the article supported during the manufacturing processis at least one of a printed circuit board and a printed circuit boardassembly.
 18. The 3D printed support block of claim 5, wherein themanufacturing process is one of a screen printing process and an x-rayinspection process.
 19. The 3D printed support block of claim 5, furthercomprising a vacuum block, wherein the vacuum connection is incommunication with a vacuum source via the vacuum block.